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The SI-C1000 system employs 3-D CAD data and laser light to shape photocoagulated resin layers, thus enabling photofabrication with a high drawing resolution of 2 µm in the XY direction and 5 µm in the Z direction. This permits the creation of three-dimension objects with a more complex structure than ever before. Spatial light modulation elements are used in the layering process in order to focus the laser light on specific areas of a photocoagulated resin layer and thus cure only that resin.

SI-C1000

With a single exposure, it is possible to cure an area over 1.3 mm x 1.8 mm at a resolution of 768 x 1,024 pixels. By repeating that procedure in the XY direction, a single finished layer is formed. By then repeating this operation over and over to obtain successive layers of cured resin, the desired three-dimensional form can be obtained.

The SI-C1000 contributes not only to shortening work time and reducing costs but also in various other ways, such as assisting research and development, test production, and much more, in many of the industries where small-lot-high-diversity and on-demand production is advancing.

■ For inquiries, contact: D-MEC Ltd.

Coilspring model Photonic fractal
Micro turbine 1 Micro turbine 2
Photographs supplied by:
Miyamoto Laboratory, Smart Processing Research Center, Joining and Welding Research Institute, Osaka University
D-MEC Ltd.

Machinery: Micromachining (micro gears, etc.)
Optics and electronics: Photonic crystals and microlens eyes
Biotechnology and medical: Genome analysis DNA-chips, biosensor chips, and micro actuators

Light source Laser diode (405 nm)
Image modulation Spatial light modulation element
Exposure resolution Approx. 2 µm (using optical resolution)
Moulding range 150 mm x 150 mm x 50 mm
Maximum model size 50 mm x 50 mm x 50 mm
(potential mould size will differ depending upon the physical memory available in the editing PC.)
Layer pitch 5 µm to 10 µm
Resin Special high-resolution resin
Interface Dedicated I/F software: "Viola"
(with the Magics editing software plug-in from Materialise NV)
Power source 100 V AC, 2 kVA
External dimensions (WxDxH) 1000 mm x 1000 mm x 1700 mm
Weight Approx. 600 kg
Laser Solutions is one of
the Mitsuboshi Diamond Industrial Group of companies.
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