 Accompanying the higher performance and higher densities being delivered in such digital devices as personal computers and cellular phones, an adequate response to the small diameter, high-precision hole drilling requirements for printed circuit boards and other products has become an important issue. A higher level of processing technology is thus demanded in manufacturing devices in order to create micro hole diameters as well as improve on their deviation from roundness, etc. |
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With the Spinning Micro Laser Drill, Laser Solutions makes excellent use of our highly-regarded laser technology and new concepts in spinning technology to achieve high-precision micro hole drilling of close to 10 µm, an order that was conventionally seen as being extremely difficult. |
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Adopts our proprietary spinning technology that rotates the object being processed at high speed. A camera built into the rotation section directly photographs the laser light in the vicinity of the object’s rotational axis and, with high speed and high precision, aligns the center of rotation and the laser’s optical axis. As a result, influence from the laser beam profile is reduced and high-quality micro hole drilling with a higher degree of roundness and parallelism is achieved.
| Laser assembly | Oscillator: Nd:YAG (355 nm) Pumping method: Laser diode Average power output: 10 W (at repeating frequency of 10 kHz) |
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| Optical system | Exposure optics: Laser beam applied to processed object Inspection optics: Processing position confirmed and processing focus aligned Built-in optics: Beam spot is monitored (Position alignment is performed between the rotation axis and the axis for the exposure optics system) |
| Stage section | Configuration: Quadaxial (XYZθ) Stroke: X axis: ±2 mm, Y axis: ±2 mm, Z axis: 12 mm Resolution: X axis: 0.1 µm, Y axis: 0.1 µm, Z axis: 0.4 µm |
| Control section | Laser repeat frequency: 100 Hz to 100 kHz Laser power: Controlled irradiation (available levels differ by frequency) Monitor: Touch panel |
| Casing | Weight: 1,200 kg External dimensions (WxDxH): 1,600 mm x 1,500 mm x 1,600 mm Installation environment Ambient temperature:20°C to 25°C [68°F to 77°F] (No abrupt change in temperature) Humidity: 20% to 50% (No condensation) Vibration: No surrounding causative factors Utilities Power requirements: 1φ 220 V AC ±10%, 5 kVA or less Grounding (Earth): Class D Pressure: 0.5 Mpa, 40 L/min |